FI Assistant Professor Feng Li Published One Top-Tier Journal Paper

Most recently, Dr. Feng Li, who is an assistant professor at the Faculty of Information Technology (FI), as the first author and corresponding author, published an academic paper in IEEE Transactions on Industrial Electronics.This paper is available at the link http://ieeexplore.ieee.org/document/8030073/, and is coauthored by her Ph.D. student Yang Jie.IEEE Transactions on Industrial Electronics, whose latest impact factor is7.168,is a top-tier international journal, ranking No. 1 among60 SCI journals in the area of Automation & Control Systems and ranking No. 12 among 262 SCI journals in the area of Engineering, Electrical & Electronic.

Dr. Fenghas been workingin the area ofenergy-efficient wireless networks.In this paper, Dr. Feng and her student study the state-of-the-art physical-layer-assisted power-management(PA-PM), and are the firstto propose a novel queueing model to study the packet delay andthe power consumption for a polling scheme (i.e., a request/response-based communication scheme) with PA-PM.With thismodel, we can minimize a station’s power consumption while meeting its delay requirement.This study can greatly promote the practicality of PA-PM, therefore being of great significance in engineering applications(such as wireless sensor networks and Internet of Things). In addition, the proposed queuing model is general enough for analyzing the performance of a broad class of polling schemes.

This studyis a part of a series of research outputs of the Macao FDCT project (hosted by Dr. Feng):"Performance Analysis and Design of Energy-Efficient Polling Schemes in Wireless LANs" (No. 013/2014/A1). It is inspired bya prior work, “A new delay analysis for IEEE802.11 PCF”, which was coauthored by Dr. Feng and her Ph.D. supervisor Li Jianqing and was published in "IEEE Transactions on Vehicular Technology". Dr. Feng's academic achievements manifestthat our universityhas made remarkable progress in the areaof energy-efficient wireless networksand has great potential for future research and development.